Marvell Technology (NASDAQ:MRVL) rallied on advanced optical interconnect technology for AI data centers, reinforcing its role in custom silicon and connectivity.

FREMONT, Calif.--(BUSINESS WIRE)--As AI and machine learning (ML) applications drive unprecedented demand for higher data rates, the industry faces the dual challenge of finalizing 224Gbps signaling ...

Numerous notable photonics-related announcements were made this week during ECOC 2026, in Málaga, Spain.

Bizlink and Ams Osram are developing optical interconnect technology designed to improve AI data centre performance.

Avicena will demonstrate the connectorized LightBundle eKit at Stand 1365 during ECOC Exhibition 2026, taking place September 21-23 at the Palacio de Ferias y Congresos de Málaga in Málaga, Spain.

Molex, a global electronics leader and connectivity innovator, today introduced VersaBeam Mini, an ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector that solves critical space, thermal and ...

MOUNTAIN VIEW, Calif., March 11, 2026--(BUSINESS WIRE)--Lightmatter, the leader in photonic (super)computing, today announced the Passage™ L20, a 6.4 Tbps (each direction) optical engine (OE) designed ...

The scaling of AI infrastructure from single racks to multi-rack and campus-scale clusters is forcing system architects to rethink how data center interconnects are designed. As deployments grow to ...

How data centers are evolving to meet the challenges of AI/ML computing. Pros and cons of common copper and optical interconnect solutions. Benefits of RF transmission over plastic cable (e-Tube) for ...

By combining plasmonics with silicon photonics, the technology supports higher-density optical links and improved energy efficiency, addressing key challenges in scaling coherent and data center ...

PLEASANTON, CA, UNITED STATES, February 10, 2026 /EINPresswire.com/ — Inneos today announced Cheetah, a ruggedized optical interconnect platform based on Inneos ...

With the clean transmission of high-speed signals a key priority in today’s electronic products and systems, design engineers continue to face the task of designing and implementing interconnection ...