Toshiba America Electronic Components Inc. (TAEC) has announced TSSOP Advance, a new smaller packaging technology that extends the company's diverse packaging options for power MOSFETs. Developed by ...
The Fine Pitch bump adapter converts TSSOP, QFP, and other fine-pitch devices to any 0.4-mm fine-pitch bumped package or routing configuration. The adapter mounts to the PCB via raised 0.25-mm pads on ...
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