TOKYO--(BUSINESS WIRE)--Tanaka Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae) today announced that Electroplating Engineers of Japan, Limited (Head ...
HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...
FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Purpose-built for a broad range of wafer-level packaging (WLP) applications, Solstice Max delivers advanced electroplating and surface preparation performance with the ability to process both 200mm ...
Applied Materials, Inc. introduces its 300mm SlimCell(TM) electrochemical plating (ECP) system that overcomes the limitations of existing plating technology to deliver a cost-effective, ...
Built by a Dutch-Chinese research team, the cell is relying on a new type of hybrid-shaped Cu finger consisting of a rectangular bottom part and a round top part, which was integrated into the cell ...
Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are ...
Meco Equipment Engineers, a subsidiary of BE Semiconductor Industries provides its Cell Plating Line (CPL) for a wide variety of next-generation solar cell architectures migrating from silver to ...
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ACM Research, a two-year-old Californian company, says it can see the end of the road for chemical mechanical polishing (CMP), and is looking to move in on the market with a non-contact process. It ...
The semiconductor industry is in the midst of a massive technological change, converting to mass-producing chips with copper, rather than aluminum, wires. The weird part: Almost no one seems to be ...
The semiconductor industry is in the midst of a massive technological change, converting to mass-producing chips with copper, rather than aluminum, wires. The weird part: Almost no one seems to be ...
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